Aluminum Nitride Ceramic Thermal Pads

Aluminum Nitride Ceramic Thermal Pads Regular Size:

• For Package Type: TO-3P/TO-220/TO-247/TO-264/TO-3/TO-254/TO-257/TO-258, With Hole or Without Hole.

• TO-3P       25x20x1mm (other thickness is available, too);
• TO-220     20x14x1mm (other thickness is available, too);
• TO-247     22x17x0.635mm (other thickness is available, too);
• TO-264     28x22x1mm (other thickness is available, too);
• TO-3         39.7x26.67x1mm (Rhombus shape);
• TO-254     34x24x1mm (other thickness is available, too);
• TO-257     40x28x1mm (other thickness is available, too);
• TO-258     50.8x50.8x1mm (other thickness is available, too).

• Other Standard Size:

• 25.4x25.4mm;
• 114.3x114.3mm;
• 152x152mm;
• 190.5x138mm …

• Customized sizes are available.

Ceramic Thermal Pads Installation Steps:

• Clean the target surface: Clean the dust or stains on the surface of the object to be installed, and then align the hole position of the ceramic insulating sheet;
• Power tube bonding: Stick the power tube on the ceramic insulating sheet;
• Fixed the insulation sheet: Use screws to fix the power tube and ceramic insulating sheet on the installation object.

AlN Product Package Requirement:

• The product is cleaned according to the requirements, after completely dried, placed in the special pearl cotton packaging box.
• One group of 100 pieces of products is placed in the small cells in the packaging box. There are 5 cells in each packaging box, and 500 pieces can be placed in total.
• After each version of the packaging box is filled with products, it needs to wrap the film tightly, and attach the quantity label.
• Put the pearl-cotton packing box into the outer carton, paste the specification and quantity label on the surface.
• Package carton size: 21x21x12cm
• Gross weight: 1.5kgs

Applications:

• Power Devices
• MOS Transistor
• Heat Sink Interface
• MOSFET Transistor
• IGBT Transistor Heat Sink
• Chip ON Film (COF) Heat Conduction
• LED Board Thermal Interface Material (TIM)
• Integrated Circuit (IC) Chip Packaging Heat Conduction

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