Compared with traditional DBC substrates, ceramic substrates prepared by AMB process not only have higher thermal conductivity and better copper layer bonding, but also have advantages such as lower thermal resistance and higher reliability. In addition, because its processing process can be completed in one heating, it is easy to operate, has a short time cycle, good sealing performance and a wide range of applications for ceramics, so this process has developed rapidly at home and abroad and has become a commonly used method in electronic devices.

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従来のDBC基板と比較して、AMBプロセスで製造されたセラミック基板は、熱伝導率が高く、銅層との接合性も優れているだけでなく、熱抵抗が低く、信頼性が高いといった利点も備えています。さらに、AMBプロセスは1回の加熱で処理が完了するため、操作が容易で、サイクルタイムが短く、封止性能に優れ、セラミックへの適用範囲も広いため、国内外で急速に発展し、電子機器における一般的な製造方法となっています。

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