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January 01,1970
CSOP: Hermetic Ceramic Package for Stable and Reliable SMT Applications
In semiconductor equipment, industrial control systems, and high-reliability electronic systems, the package not only provides electrical connections but also directly affects the long-term stability of the device in high-temperature, vacuum, or otherwise demanding environments. Although traditional plastic-encapsulated SOP packaging is cost-effective and fast to produce, it is susceptible to aging, leakage, or performance degradation under