Aluminum nitride products are attracting more and more attention as a new generation of high thermal conductivity materials due to their superior thermal conductivity, high insulation, and thermal expansion rate close to silicon.
Features:
- High thermal conductivity: about 7 times the thermal conductivity of alumina
- Thermal expansion rate: thermal expansion is close to silicon, and the reliability of the mounting of large silicon wafers and heat-resistant cycles
- Electrical characteristics: high insulation, low dielectric coefficient
- Mechanical properties: superior to the mechanical properties of alumina
- Corrosion resistance: stronger than molten metal corrosion resistance
- Purity: low impurity content, non-toxic, high purity
Application:
- High-power transistor module substrate
- High-frequency device substrate
- Heat-radiating insulation board for turn module
- Fixed substrate for semiconductor laser and light-emitting diode
- Hybrid integrated module, the ignition device module
- IC package
- Thermal module substrate
- Some products for semiconductor production equipment
