Direct Bonded Copper Substrates
DBC ceramic substrate, short for Direct Bonded Copper Ceramic Substrate, is an advanced material composed of a ceramic substrate (typically Al2O3 or AlN) and copper, tightly joined together through a hypo-eutectic process. This unique combination of materials results in a substrate with exceptional thermal conductivity, low thermal expansion, high strength, and excellent wettability for soldering applications.
Direct Bonded Copper Ceramic Substrates Material Property
– Low Thermal Expansion – High Strength – High Thermal Conductivity – High Wettability for SolderDirect Bonded Copper Ceramic Substrates Applied Area
– Power Electronics: IGBT, MOSFET, Thyristor Module, Solid-state Relay, Diode, Power Transistors – Automotive: ABS, Power Steering, DC/DC Converter, LED Lighting, Ignition Control – Home Appliance: Air Conditioner, Peltier Cooler – Environmental Technology: Local Power Generation, Electric Vehicle, Traction Control System, Photovoltaic Units, Wind Power – Industrial: LED Displays, Welding Machine – Aerospace: Laser, Power Supply for Satellites and Aircrafts – PC/IT: Power Supply, UPS SystemBy Materials
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