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Boron Nitride Ceramics

Boron Nitride Ceramics

Hexagonal Boron Nitride has a microstructure similar to that of Graphite. In both materials this structure, made up of layers of tiny platelets, is responsible for excellent machinability and low-friction properties. we called hexagonal boron nitride (HBN) or white graphite.

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Material of Boron Nitride Ceramics

  • Pyrolytic Boron Nitride: 99.99% Boron Nitride*
  • UHB: >99.7% Boron Nitride
  • HB: >99% Boron Nitride
  • BC: >97.5% Boron Nitride
  • BAN: Boron Nitride + Aluminum Nitride
  • BMZ: Boron Nitride + Zirconium Oxide
  • BMA: Boron Nitride + Zirconium Oxide + Aluminum Oxide
  • BSC: Boron Nitride + Silicon Carbide
  • BMS: Boron Nitride + Silicon Oxide+Aluminum Oxide
  • BSN: Boron Nitride + Silicon Nitride

Processing of Boron Nitride Ceramics

  • Hot Pressed Sintering
  • Chemical Vapor Deposition

Applications of Boron Nitrides Ceramics

  • Thermal Management

    Excellent electrical insulation and thermal conductivity make BN very useful as a heat sink in high-power electronic applications. Its properties compare favorably with beryllium oxide, aluminum oxide, and other electronic packaging materials, and are easier machinable to desired shapes and sizes.
  • High Temperature Environments

    Temperature stability and excellent resistance to thermal shock make BN the ideal material in the toughest high-temperature environments such as equipment for plasma arc welding, diffusion source wafers, and semiconductor crystal growth equipment & processing.
  • Molten Metal Handling

    BN is inorganic, inert, nonreactive with halide salts and reagents, and is not wet by most molten metals and slags. These characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processes.
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Comparison of Boron Nitride Ceramics

Properties Unit UHB HB BC BMS BMA BSC BMZ BAN BSN
Main Composition - BN>99.7% BN>99% BN>97.5% BN+SiO2 BN+Al2O3 BN+SiC BN+ZrO2 BN+AlN BN+Si3N4
Color - White White White White Graphite White Graphite Greyish-Green White Graphite Greyish-Green Gray Black
Density g/cm3 1.6 2 2.0~2.1 2.2~2.3 2.25~2.35 2.4~2.5 2.8~2.9 2.8~2.9 2.2~2.3
Three-Point Bending Strength MPa 18 35 35 65 65 80 90 90 /
Compressive Strength MPa 45 85 70 145 145 175 220 220 400~500
Thermal Conductivity W/(m·k) 35 40 32 35 35 45 30 85 20~22
Thermal Expansion Coefficient (20~1000°C) 10-6/K 1.5 1.8 1.6 2 2 2.8 3.5 2.8 /
Max Using Temperature In Atmosphere In Inactive Gas In High Vacuum (Long Time) °C 900 2100 1800 900 2100 1800 900 2100 1900 900 1750 1750 900 1750 1750 900 1800 1800 900 1800 1800 900 1750 1750 900 1750 1700
Room Temperature Electric Resistivity Ω·cm >1014 >1014 >1013 >1013 >1013 >1012 >1012 >1013 /
Typical Application - Nitrides Sintering High Temperature Furnace High Temperature Furnace Powder Metallurgy Powder Metallurgy Powder Metallurgy Metal Casting Powder Metallurgy Metal Casting
High Temperature Electrical Furnace Components - -
Metal Vaporize Crucible
The Container of Metal or Glass Melting -
The Casting Mould Components of The Precious Metal and Special Alloy. - - - - - -
High Temperature Support Part - - - - - -
Nozzle and Transport Tube of The Melting Metal - -
Nitrides Sintering (Sagger and Setter Plate) - - - - - - - - -
Remark: The value is just for review, different using conditions will have a little difference.

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Product Catalog

Boron_Nitride

Version

2026-03-19

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