Aluminum Nitride Ceramics
With its properties of electrical insulation and excellent thermal conductivity, Aluminum Nitride (AlN) Ceramics is ideal for applications where heat dissipation is required. In addition, since it offers a coefficient of thermal expansion (CTE) near that of silicon, and excellent plasma resistance, it is used for semiconductor processing equipment components.
Aluminum Nitride (AlN) Ceramics exhibit exceptional characteristics as below:
- Good mechanical properties,
- Higher flexural strength than Al2O3 and BeO ceramics,
- High temperature and corrosion resistance.
- High thermal conductivity combined with good electrical insulation characteristics.
- Exceptional stability when exposed to many molten salts.
- Thermal stability up to at least 1500°C
- Favorable mechanical characteristics extending into the high temperature range.
- Low thermal expansion and resistance to thermal shock.
- Special optical and acoustic characteristics.
Aluminum Nitride Ceramic Physical Properties:
| Properties | Value |
| Color | Dark Gray |
| Main Content | 96%ALN |
| Bulk Density(g/cm3) | 3.335 |
| Water Absorption | 0.00 |
| Flexural Strength(MPa) | 382.70 |
| Dielectric Constant(1MHz) | 8.56 |
| Coefficient Linear Thermal Expansion(/℃,5℃/min, 20-300℃) | 2.805*10-6 |
| Thermal Conductivity(30 degree Celsius) | >=170 |
| Chemical Durability(mg/cm2) | 0.97 |
| Thermal Shocking Resistance | No cracks |
| Volume Resistivity(Ω.cm) (20 degree Celsius) | 1.4*1014 |
| Dielectric Strength(KV/mm) | 18.45 |
| Surface roughness Ra(μm) | 0.3-0.5 |
| Camber(length ‰) | <=2‰ |
Forming Processing:
- Ceramic Injection Molding
- Low Pressure Injection Molding
- Cold Isostatic Press
- Dry Press
- Tape Casting
- Precision Machining Processing
Aluminum Nitride Ceramic Products:
- AlN Ceramic Heat-sinks for high power system
- AlN Crucible, Al evaporating dish and other high-temperature corrosion resistant parts.
- Direct Bond Copper Substrates (DBC)
- AlN Ceramic Rod
- ALN Ceramic Wafer
- ALN Ceramic Substrate
- AlN Ceramic Heater
- Custom Shape
Aluminum Nitride Ceramic Components Application:
- Components for semiconductor equipment
- IC packaging
- Thermal module substrate
- High power transistor module substrate
- High frequency device substrate
- Exothermic insulation board for Thyristor Modules
- Semiconductor laser, fixed substrate for light emitting diode (LED)
- Hybrid integrated module, ignition device module
- Used in the sintering of structural ceramics
- AlN Crucible for Metal Melting & Electronic cigarettes
- Applied to luminous materials
- Applied to the substrate material
Regular Specification of ALN ceramic substrate:
Length &Width: 25.4mm; 50.8mm; 63.5mm; 76.2mm; 101.6mm; 114.3mm; 127mm; 152.4mm. Thickness: 0.25mm; 0.5mm; 0.63mm;1mm;1.5mm; 2mm.By Materials
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