Features
- High thermal conductivity
- Thermal expansion coefficient close to silicon wafer
- High strength and toughness
Application
- High power IGBT power module
- High power heat sink
- Wireless module
Material Properties Table
| Project | Test conditions | Unit | Si₃N₄ | |
| SN-90 | ||||
| Material | - | - | Si₃N₄ | |
| Appearance | - | - | grey | |
| Surface roughness | Ra | μm | 0.2~0.75 | |
| Density | - | g/cm 3 | ≥3.2 | |
| Physical properties | Bending strength | 3 -point bending resistance | MPa | ≥750 |
| Vickers hardness | Load 4.9 | GPa | ≥14 | |
| Water absorption | - | % | 0 | |
| Thermal performance | Thermal conductivity | 25℃ | W/(m·k) | ≥85 |
| Linear thermal expansion coefficient | 25-500℃ | x10 -6 mm/℃ | 2~4 | |
| Thermal shock resistance | 800℃ | Time | ≥10 | |
| Specific heat | - | J/(kg·K) | 680 | |
| Electrical properties | Dielectric constant | 1MHz/25℃ | - | 7~8 |
| Dielectric loss | 1MHz/25℃ | x10 -4 | ≤4 | |
| Volume resistivity | 25℃ | Ω·cm | > 10 14 | |
| Breakdown voltage | - | kV/mm | > 15 | |
| Light performance | Reflectivity | Reflectivity meter | - | - |
| Whiteness | Whiteness meter | - | - | |
Specifications and Dimensions
| Material | Unit | Al₂O₃ | ZTA | AlN | Si₃N₄ |
| Effective dimensions ( A , B ) | mm | 50.8-190 | 50.8-190 | 50.8-190 | 138*190 |
| Thickness ( T ) | mm | 0.25-1.5 | 0.25-1.5 | 0.25-1.0 | 0.25 , 0.32 |
| Thickness tolerance | mm | ±5% ( Min±0.03mm ) | ±5% ( Min±0.03mm ) | ±5% ( Min±0.03mm ) | ±5% ( Min ±0.03mm ) |
| Warpage ( C ) | mm | ≤0.3% | ≤0.3% | ≤0.3% | ≤0.3% |
| surface roughness | μm | 0.2-0.6 | 0.2-0.5 | 0.2-0.75 | 0.2-0.75 |
| Size, thickness and surface roughness can be customized | |||||
Processing
• Laser processing
• Grinding and polishing sheet roughness table
| Project | Qualified | Special Grade | ||
| Internal dimension tolerance | ±0.05mm | ±0.03mm | ||
| External dimension tolerance | ±0.15mm | ±0.1mm | ||
| Hole tolerance (φ0.07-0.15mm) | ±0.05mm | ±0.02mm | ||
| Hole tolerance (φ ＞ 0.15mm) | ±0.1mm | ±0.02mm | ||
| Project | Surface roughness (μm ) | |||
| Qualified | Special Grade | |||
| Grinding | 0.3-0.6 | 0.3-0.5 | ||
| Fine grinding | 0.1-0.4 | 0.1-0.3 | ||
| Polishing | ≤0.1 | ≤0.05 | ||
